The BondMaster® 600 delivers a powerful combination of multiple mode bond testing
software and highly advanced digital electronics, providing consistently crisp and
high-quality signals. Whether you are inspecting honeycomb composite, metal-to-metal
bonds, or laminate composite, the BondMaster 600 offers exceptional ease-of-use
thanks to its direct-access keys and streamlined interface that features convenient
presets for common applications. The enhanced user interface and simplified workflow
of the BondMaster 600 offers archiving and reporting that are accessible to any
level of user. The resolution and brightness of the 5.7-inch VGA screen on the BondMaster
600 handheld bond tester becomes even more apparent when switched into full-screen
mode. Activated by the simple touch of a key, the full-screen mode is always accessible
regardless of the display mode or inspection method you are using. The BondMaster
600 bond tester is programmed for a range of standard inspection methods, including
pitch-catch RF, pitch-catch impulse, pitch-catch swept, resonance, as well as a
notably improved mechanical impedance analysis (MIA) method.
Key Features
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Designed to meet the requirements of IP66.
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Long battery life (up to 9 hours).
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Compatible with existing BondMaster probes (PowerLink) and probes from other manufacturers.
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Bright, 5.7-inch color VGA display.
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Full-screen option in any display mode.
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Intuitive interface with application-specific presets.
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Instant display mode toggle using the RUN key.
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New SCAN view (profile).
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New SPECTRUM view and Frequency Tracking feature.
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Direct-access key gain adjustment.
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All-Settings configuration page screen.
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Up to two real-time readings.
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Storage capacity of up to 500 files (program and data).
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On-board file preview.
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